MWC, the leading mobile communications showcase in the world, will be postponed because of the COVID-19 epidemic. However, the release of 5G mobile phones is still increasing momentum in their launch. Sony, Huawei, Realme, and other major companies have adopted diverse ways for the live online broadcasting for the release of their mobile phones. In summary of the features of these new leading models, they mainly support 5G, with more powerful processors, multi-lenses, folding options, etc., supporting the expected market content. It is projected that the improvement of these functions will prompt the upgrade of board specifications and usage increases regarding SLP, soft boards for antennas, AiP, BT substrates, etc. Consequently, these changes should visibly benefit the PCB supply chain.

 

According to the relevant institute investors, 2020 is going to be the period of explosive growth for 5G smartphones. When Apple presents 5G with its new smartphone model in the second half of 2020, this should assist in influencing the unit output value for SLP motherboards by 10% to 15%. As for the related supply chains, the industry is positive about the benefits provided by new capacities, and the yield and efficiency of SLP by Zhen Ding is considered to rank first in the trade. As previously described by Zhen Ding, it will continue to place focus on computers, featured phones, smartphones, 5G, and the Internet of Things in 2020. Among them, further growth is expected for mobile phones. Also, other products such as flexible boards, IC substrates, automotive boards, server boards, HDI, rigid-flex board, backlight module board, COF, etc., have been viewed with optimism by investors.

 

Institute investors are also optimistic that Compeq will profit from medium and high-end HDI with 5G mobile-phone boards. Although mainland- capital plants have been vigorously deploying HDI-related production capacities and there are many efficient producers, their production capacity from medium and high-end processing remains limited since it is difficult for these plants to keep up with Taiwanese plants’ capacity, quality, and delivery time in the short run. Essentially, Compeq announced in 2019 that the progress of the design direction for mainland-based customers gearing towards high-end Any-layer HDI remains clear and unchanged and the company is prudently optimistic about their needs and expects promising prospects for medium and high-end HDI.

 

As for 5G antennas, institute investors expect that the proportion of Apple antennas adopting LCP should rise in 2020, while the antennas among non-mobile products will be promoted to MPI. As such, the related supply chains with Zhen Ding and Flexium are expected to profit from this, of which Flexium is considered as the first operator to recommend using new materials such as MPI and achieved mass production in 2018. As a result, Flexium has received quite a lot of market attention. (News Source: Commercial Times)