The Largest Investment Made to Date by the PCB Industry: Unimicron places as much as NT$20 billion on the high-end substrate
發佈日期:2019-05-20
新聞類型:
On May 9th, the board of directors at Unimicron (a PCB manufacturing plant), approved the investment plan of their plant expansion for the high-end IC flip-chip substrate. It is estimated that it will invest approximately NT$20 billion to develop 5G, AI, and a big data center, expected to run from the current year to 2020., The investment has been considered as a result of the need for high-end technological development required in our epoch.
Unimicron stated that it hopes to cooperate with world-class companies to develop niche technology including high-end and advanced IC flip-chip substrate required for 5G, AI, and a big data center in our history. Unimicron also states the role of developing niche technology for the purposes of enhancing the competitiveness of technology and business in parallel. As emphasized by Unimicron, the sources of finance will include both self-funding and bank loans. The amount of capital expenditure directly and/or indirectly invested by the company will be included in the annual capital expenditure plan and will be implemented after the resolution by the board of directors.
Unimicron’s consolidated revenue for the first quarter is NT$17.273 billion, with a combined gross profit margin of 11.37%; further, there is the quarterly decrease of 3.79%, with an annual increase of 4.34%. Altogether, the net profit after tax is NT$669 million, with a quarterly decrease of 11.16% and an annual increase of 94.73%. The surplus per share is NT$0.27. (News source: Liberty Times)
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