Not only have changes in the flexible and rigid PCB manufacturing processes of SLP (substrate-like PCB) and roll-to-roll method led to surging demand, their lower production costs have also resulted in export growth of PCB equipment to South Korea this year. CBT, UTECHZONE, and Group Up are among the manufacturers that have benefited.

 

UTECHZONE, the optical inspection equipment factory, is rapidly expanding its PCB plant. The 5G layout has also driven a series of industrial upgrading cycles, such as packaging, COF (chip on film), flexible PCB, and SLP (substrate like PCB). UTECHZONE has preemptively laid out various markets, and all industries have responded with complete product lines and will actively continue to explore the leading manufacturers. An executive of UTECHZONE explained that the company has taken advantage of plant expansion opportunities related to China-invested flexible PCB factories in the first half of this year. In addition to receiving orders from mainland China’s largest flexible PCB factory, it has also successfully invaded a number of emerging flexible PCB listed companies in South China and acquired the next wave of 5G plant expansion layouts from South Korea’s Samsung supply chain of flexible PCB factories to receive all the orders of product appearance inspection equipment.

       

Group Up, which has been OTC-approved in IPO (initial public offerings), will be listed no later than September based on its planning progress. The President of Group Up, Chen An-Shun, stated that the company’s growth momentum is the result of the introduction of SLP (substrate-like PCB) into the manufacturing process of Any-layer HDI (high density interconnect) for mobile phone motherboards. Furthermore, the flexible PCB factory has begun to extensively use roll-to-roll vacuum laminating equipment, and the demand for ultra-slim substrates FC-CSP (flip chip-chip scale package) and the automatic drying line used in automobile ultra-thick PCBs is growing.

 

After the PCB exposure equipment factory, CBT changed all its light source equipment into low-power consumption and environmentally-friendly LED light sources, significantly increasing its revenue in the cross-strait market. Meanwhile, the latest LDI (laser direct imaging) exposure field that CBT has recently invested conforms to the market demand of fine line and high-quality specifications. Assistant General Manager Lizhen Jian remarked that the current product development is mainly based on the application of PCB solder-proof processes but is also actively venturing into the market demand of PCB factories throughout Asia, including South Korea. (News source: cnYES)