The rapid changes of IoT products, such as wearable devices, mobile devices, etc. are likely to affect product marketing schedules as after a new generation of products is launched, the next-generation products are on the waiting list to be designed. This happens when the design engineer spends too long in designing the circuit layout.
 

       In the past, while designing a mixed-signal PCB, the designer often worked on a piece of paper or planned it on a computer before finding the components for the PCB. A manufacturer was then asked to make prototypes before proceeding with tests. But after the tests, some components might be found unsuitable and needed to be replaced. Hence, the power layout design process might take several weeks or even several months to prepare.
 

       In this regard, John Teegen, the Vice President of Dialog Semiconductor cum General Manager of the Configurable Mixed-signal Business Unit believes that the software platform of drag-and-drop module concept should be used in PCB designing in the future. This way, no matter how the configuration is modified or amended, etc., the speed can be improved. Furthermore, before finish testing, if there is a need to amend some hardware components, it is only necessary to perform a new schedule change on the software platform.

       As a result, from the beginning of PCB designing to the completion of a final prototype, the use of block stacking concept is expected to be completed in just a few days from the past few weeks, and able to significantly accelerate the marketing schedules of IoT products. In addition, not only can such designing mode accelerate the product marketing time, but also increase the component integration extent, thereby allowing the designer to simplify the circuit design and reduce design development costs.