Defect Inspection Machine for Electroplated Copper Lines (Before Flash Etch) (for HDI/SLP/IC substrate/ETS)
Model: Defect Inspection Machine for Electroplated Coppe
Category: AOI
Exhibitor: Favite Inc.
Booth No: TBA
Characteristic
Features AI real-time detection; detection operation speed can be up to 50 FPS Open/Short/Dent defect detection Effectively avoid false spots of copper particles/different colors/foreign objects Provide SAP/mSAP/amSAP flash/pre-etch copper plating lines The best inspection solution
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