NPI Schedule

  • Accordance Systems Inc.

  • 12/21 10:10-10:50

  • BIG DATA Edge Computing

  • Accordance Systems provides Edge Computing systems, bringing distributed computing on the cloud to the site of the industrial manufacturing line. The solution improves the calculation ability of onsite systems, collects heterogeneous big data and provides machine learning solutions. It realizes real-time data analysis, in-time device, and production index monitoring. From production of data, collection, and analysis, to providing a basis for future decisions, the original data is turned into valuable knowledge. The information accumulated from past experiences will assist the industry in refining the manufacturing process, elevating production efficiency, and realizing smart manufacturing.
  • TRIALLIAN CORPORATION (Non-Competition)

  • 12/21 11:00-11:40

  • SLOTOGO IT1-New vision of using ultra-thin flash via-filling on mSAP /large via and others processes applications.

  • In response of the development of 5G advanced technology, proposing the ultra-thin flash via-filling system fulfill various via filling specifications. Moreover, combine with the application of the RPP system in which can improve the uniformity of fine line plating; trace planarity as well as high TP% in case for through hole plating.
  • Takewin International Co., Ltd.

  • 12/21 13:00-13:40

  • The Distance Between Industrial Transformation and Us

  • 1.The up to date trends in IIoT

          2.How to accelerate the journey to smart manufacturing

  • Okuno Taiwan Co.,Ltd. (Non-Competition)

  • 12/21 14:00-14:40

  • Via-filling acid copper plating additive designed for horizontal RotoR plating “TOP LUCINA SVP”.

  • In horizontal RtoR production lines ,faint electric current among cells makes copper filling of BV Hdifficult .The cause of the filling degradation is elucidated and its corresponding technology is introduced in following chapters.
  • Okuno Taiwan Co.,Ltd. (Non-Competition)

  • 12/21 15:00-15:40

  • The void -free final surface treatment “ICP-COA process”with using reduction type Co catalyst.

  • Features of “ICP ACCERA COA “with using reduction type Co catalyst and electroless plating film property catalyzed with ICP ACCERA COA instead of conventional Pd catalyst is introduced.
  • Digihua Intelligent Systems Co., Ltd. (Non-Competition)

  • 12/21 16:00-16:40

  • Efficient manufacturing solutions for PCB/PCBA

  • Digihua, as a advanced MOM(Manufacturing Operations Management) efficient solutions supplier, a.k.a PCB/PCBA expert, We provide several high-efficiency solutions to the needs of the PCB/PCBA industry and help enterprise build competitive advantages such as “cost reduction”, “efficiency enhancement”, “quality improvement”, “reserve reduction”, and “innovation”, through MES, APS, QMS and IIoT by the architecture of MOM(Manufacturing Operations Management).
  • JCU TAIWAN CORPORATION (Non-Competition)

  • 12/22 10:10-10:50

  • 次世代填孔電鍍技術發表

  • TF7-對應載板高均勻性電鍍要求
    VLX-對應HDI薄面銅電鍍要求
  • Macnica Galaxy Inc.

  • 12/22 11:00-11:40

  • Ansys – Next generation high speed printed circuit board design

  • Ansys offers a complete, most powerful and accurate simulation
    solution for next generation high speed printed-circuit-board (PCB),
    including differential trace , via, pcb stack up and power integrity
    design.
  • Taiwan Union Technology Corporation (Non-Competition)

  • 12/22 13:00-13:40

  • New Advanced Laminate Materials for High Speed and High Frequency Applications

  • In response to the needs of 5G applications, high-speed and high-frequency technologies have become the two mainstream of the current PCB industry, and ultra-low-loss laminate materials with high reliability are the most important development directions for today’s CCL suppliers. TUC’s new advanced materials for high speed and high frequency applications are presented in this year’s seminar, including ThunderClad 200G/400G/800G for high-speed applications and PegaClad series materials for sub6GHz/mmWave antenna/radar applications.
  • TRIALLIAN CORPORATION (Non-Competition)

  • 12/22 14:00-14:40

  • The application of reduced graphene oxide metallization process on advanced PCB process-SLOTOGO IT5.

  • Utilizing the unique electroplating mechanism as well as the special features properties of reduced graphene oxide metallization process, providing the flexibility and optimizing of the existing process to meet 5G high-quality specifications requirements. Meanwhile, SLOTOGO IT5 will propose a promising process as a new option that can achieve high yield of fine line together with via filled plating.
  • Takewin International Co., Ltd.

  • 12/22 15:00-15:40

  • Practices to Secure Your OT Transformation

  • Electrical manufacturers are active to start their digital transformation and re-organization. However, it might be threated by hackers and result in ransomware, data leakage and other potential risks. It’s crucial for manufacturers to prevent from these threats and decrease the cost of transformation at the same time.
  • DuPont Taiwan Limited (Non-Competition)

  • 12/22 16:00-16:40

  • New Generation SAP E’less Cu – CIRCUPOSIT™ SAP8000

  • Excellent Coverage & Reliability for HSHF IC Substrate
  • Takewin International Co., Ltd.

  • 12/23 10:10-10:50

  • Solving the Common Challenges to Intelligent Manufacturing

  • Industrial transformation and re-organization should be started with the premise that performance won’t be affected and existing systems work smoothly. All the manufacturers should overcome the key challenges that how to practice workflows and digital optimization so that make transformation happened step by step. eCloudvalley will share the practical transformation process and solutions that business managers and executives look forward to.
  • Topoint Technology Co., Ltd. (Non-Competition)

  • 12/23 11:00-11:40

  • 5G · AI · Metaverse – Advanced mechanical drilling solution.

  • 介紹尖點最新的技術開發,應用於高端5G與HPC的加工事例
  • ITEQ CORPORATION (Non-Competition)

  • 12/23 13:00-13:40

  • Halogen Free、Low Loss、High Modulus Material for 5G CCL

  • Because of the 5G coming, it change the user experience of internet on Mobile. Mobile was designed for lighter & smaller. For Matching the purpose, the SLP material requirement is shown for mSAP process in PCB.
    Our Development is based on the Market Research & future requirement of material to design the suitable each property(ex: Tg, CTE, Storage Modulus, Dk/Df, etc…)
  • TRIALLIAN CORPORATION (Non-Competition)

  • 12/23 14:00-14:40

  • The innovative concept of mSAP/SAP process

  • With the development of 5G, AI, and network communications, the SAP and mSAP process have been comprehensively upgraded to meet the needs of fine line; the plated Cu uniformity; and the flatness on filled-via surface. A new electroplating system-DP70, which subvert the old thinking and provide a innovative concept to fit the demand.