NPI Schedule

  • ACI Materials Inc.

  • 10/26 11:00-11:40

  • Innovation for Flexible & Stretchable Printed Electronics

  • Flexible and integrated electronics are part of our future. For this, new flexible and versatile technologies are needed. ACI Materials’ functional inks deliver performance (conductivity & stretchability) that is setting a new standard in the market, allowing users to expand their possibilities.
  • Taiwan Union Teachnology Corporation (Non Competition)

  • 10/26 13:00-13:40

  • New Advanced Materials for LEO and mmWave Radar Applications

  • In addition to high-speed, high-frequency RF is a very important and urgent technology to be developed in Taiwan’s PCB industry to meet the needs of 5G applications. In this year’s NPI seminar, we will introduce TUC’s RF/mmWave products- PegaClad series, which can be applied to low-orbit satellites and mmWave automotive radar.
  • JCU Taiwan Corporation (Non Competition)

  • 10/26 14:00-14:40

  • Beyond 5G Manufacturing Process Engineering

  • Recent years, artificial intelligence technology has been widely used in all walks of life and various products. Therefore, in order to meet these changing needs, JCU proposes processes to be used on these product substrates.
  • Bossman Inc. (Non Competition)

  • 10/26 15:00-15:40

  • PCB production yield & improved ergonomic engineering plan

  • MPI CORPORATION

  • 10/27 11:00-11:40

  • Full range solder paste micro-dispensing introduction

  • One-stop solution for solder paste micro-dispensing on PCB
  • Microsys Engineering Co., Ltd.

  • 10/27 13:00-13:40

  • Micro & nano printing for chips/circuit repair and semi-conductors application

  • Nano printing repairs on circuits and can be printed on high-density circuits. In addition, more applications can be developed using conductive and non-conductive materials in semiconductor processing
  • DuPont Taiwan Limited  (Non Competition)

  • 10/27 14:00-14:40

  • Next Generation Pulse Electroplating Copper “PPR-III” for Advanced MLB

  • An innovative pulse electroplating copper metallization package with high throwing power, good uniformity, and excellent reliability for advanced MLB applications.
  • OKUNO TAIWAN CO.,LTD. (Non Competition)

  • 10/28 11:00-11:40

  • OKUNO’s TOP LUCINA Series of copper sulfate plating additives for via filling with excellent uniformity in wiring film thickness

  • “OKUNO has been developing products to solve the problem of ensuring uniformity of film thickness due to the miniaturization of wiring, and has developed products that can handle up to L/S=5/5.
    We will now introduce TOP LUCINA GAP for large-diameter BVH and TOP LUCINA HS5 for small-diameter BVH.”