New Product Introduction

  • TRIALLIAN CORPORATION

  • 10/21 13:00-13:40 Room A

  • The newest via filling system for 5G communications products.

  • The SLOTOCOUP SF50 is the newest via filling system from Schloetter, which is for the advanced via filling process of various products of 5G, such as the process of large blind via filling + through hole plating (optical transceiver/ automotive) , The core layer X-via filling (HDI-mSAP/substrate) , and the Thermal bar process, SLOTOCOUP SF50 can provide stable, excellent filling power, and easy maintenance, which is the best solution for the next generation via filling process.
  • Okuno Taiwan Co.,Ltd.

  • 10/21 13:00-13:40 Room B

  • 5G applicable electroless Copper plating process for high connection reliability “ OPC FLET PROCESS “

  • OPC FLET process can achieve superior adhesion with low roughness PCB for high frequency. It also improves connection reliability with inner Copper layer because its high purified electorless copper film is thin and seamless crystal composition between inner Copper foil at the bottom, electroless Copper film and acid Copper film.
  • TAIWAN UNIONTOOL CORP

  • 10/21 14:00-14:40 Room A

  • The advanced mechanical drilling and routing technology in 5G era

  • Introducing the latest technological development status of Union Tool, along with the processing case studies of 5G generation high-end PCB
  • Wishing Software Development Co.,LTD

  • 10/22 11:00-11:40 Room A

  • Data to Decision -the Next revolution of ESH Management

  • Wishing-Soft has developed a global ESH software for ESH management for years. By sharing our global clients’ successful use case, we’ll show the benefits, risks, and opportunities for the digital transformation of ESH management .
  • Rogers Taiwan Inc.

  • 10/22 11:00-11:40 Room B

  • TREND AND DEVELOPMENTS IN PCB MATERIALS FOR 5G WIRELESS INFRASTRUCTURE MARKET

  • As we know, 5G has been commercialized on a large scale in China this year, and the number of 5G mobile users has exceeded
  • Taiwan Union Technology Corporation

  • 10/22 13:00-13:40 Room B

  • High frequency Laminates for RF/mm Wave Applications

  • In response to the needs of 5G application, in addition to high- speed, high- frequency RF is also a very important and urgent technology to be developed in Taiwan’s PCB industry. In this year ‘s NPI seminar, we will introduce TUC’s RF/mmWave products- PegaClad series, which can be 8 plied 20 ;5G products in the Sub6GHz and mm Wave fields as well
  • Chunghwa Precision Test Tech.CO.,Ltd.

  • 10/22 15:00-15:40 Room B

  • CHPT PCB total solutions are intelligence manufacturing ecosystems that transform into intelligence manufacturing, and solve the pain point, implement intelligence factory.

  • In CHPT “Smart Manufacturing” solution has a complete smart manufacturing ecosystem. We provide products and services such as AIoT sensors, artificial intelligence, edge computing systems, equipment intelligence. In the meantime, smart management platforms implement the wisdom of real AI Solutions to create sustainable competitiveness for your business under the impact of the wave of intelligence.
  • Notion Systems GmbH

  • 10/23 13:00-13:40 Room A

  • N.jet Soldermask Application

  • CBN 700MHz also brings the requirement of high power. China is also working on the develop of mm-Wave, which brings the
  • Lapro Technology Co., Ltd.

  • 10/23 14:00-14:40 Room B

  • High throughput solder mask DI system introduction for conventional solder mask inks

  • explain how Rogers Corporation is meeting these challenges.
  • TRIALLIAN CORPORATION

  • 10/23 15:00-15:40 Room A

  • PPR engineering for all kinds 5G server PCB design

  • 5G communication network gives whole new application. High speed wireless transmission provides us open / save data in anytime and anywhere. Numerous communication equipment is required during this time which 5G is blooming. Strong PCB demand like antenna, server, optic module… still. Seems no influence after COVID-19 pandemic outbreak.
    Prospect of server market will increasing 50% till 2025.
  • TRIALLIAN CORPORATION

  • 10/23 15:00-15:40 Room B

  • An innovational copper pillar plating process for 5G advanced 3D package substrate

  • In response to the difficulties of chip multi-function design, PoP (Package on Package) packaging applications has become one of the important trends for future. In order to fulfill PoP packaging design, it has to introduce copper pillar in the substrate design to overcome the problem of docking. But due to various considerations and difficulties especially in plating it is still not possible in mass production currently Slotogo-IT process is an innovational copper pillar plating process to make production come truth.